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PRODUCTS » GO / NO-GO Box
Key Benefits
- Reduce misproduction and rework
caused by damaged or unclean reticles. - Increase the ROI of your inspection systems.
In many fabs it is common practice to use the maximum particle size reported by a particle detection system as the "go/no-go"criteria for the qualification and the use of a reticle for exposure. This is based on the dangerous assumption that only a certain minimum particle size prints.
Key Features
iCADA's "GO/NO-GO BOX" gets more out of such inspection results: it performs an in-depth analysis and recognizes patterns such as scratches or torn pellicles. Such patterns are typically more severe than the corresponding series of individual defects reported by the inspection system.
When the box alarms, the customer's automation can stop the tool and thus, avoid product loss!
In combination with the iCADA Reticle Management System (RSM) the box can take a reticle's inspection history into account for the analysis and detect adders (new defects). The box can also interpret defects on the background of the reticle's mask set properties. It can find the reticle's wavelength and the CD and determine killer defects depending on the mask's properties. Note:The higher the mask level the more critical are defects because of the added value to the wafers! New inspection results are automatically uploaded t the RSM and are available for reporting and quality control.
Case Study:
A customer had an incident where 7 out of 9 devices were defective because METAL2 was exposed with a reticle with a broken pellicle. They had to scrap two 6 inch lots (2x24 wafers) because the problem was detected too late (after etch). If the value per wafer would have only been $2k (very, very conservative estimation) then they had a product loss of $96k because of the single torn pellicle.
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